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| Datasheet File OCR Text: |
| PDF: 2002 Nov 27 Philips Semiconductors Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 6 x 5 x 0.85 mm SOT685-1 0 X D B A 2.5 scale 5 mm A A1 c E detail X terminal 1 index area terminal 1 index area 1 L e1 e b 4 vMCAB wMC y1 C C y Eh eh exposed tie bar (4x) 8 Dh DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 (1) 5 A1 0.05 0.00 b 0.5 0.3 c 0.2 D (1) 5.15 4.85 Dh 3.95 3.65 E (1) 6.15 5.85 Eh 3.65 3.35 e 1.27 e1 3.81 eh 0.35 L 0.75 0.50 v 0.1 w 0.05 y 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT685-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-08-12 02-11-27 --- |
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